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0.1mm Diamond Dicing Blades Without Matrix High Precision Cutting

Basic Information
Place of Origin: CHINA
Brand Name: RUNNING TECH
Model Number: RTM1A8C-001
Minimum Order Quantity: 5pcs
Price: Usd30-50 Per Piece Fob
Packaging Details: Plastic Inner box + Carton box outer side
Delivery Time: 7-20days
Payment Terms: T/T, L/C, D/P, Western Union
Supply Ability: 10,000pcs per Month
Detail Information
Shape: Super Thin Parallel Wheel, Circle Grinding Material: Diamond Grits
Type: Integral Blade Without Matrix Out Diameter: 50-120mm
Inner Diameter: 32 Or 40mm Thickness: 0.1-1mm
Grit Size: 120-1500 Processing Object: Semiconductor,Optical Glass, Ceramics, Magnetic Material Etc. Etc
High Light:

0.1mm 50mm Semiconductor Diamond Dicing Blades

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50mm 0.1mm Diamond Dicing Blades

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Semiconductor 0.1mm round cutting blades


Product Description

Super Hard Tools of Hi Precision Metal Sintered Diamond Dicing Blade 

 

To abrasive or cut  Semiconductor,Optical Glass, Ceramics, Magnetic Material etc. etc

 

 

Diamond wheel shape and indicates:

 

D -- Out Diameter

H -- Inner Diameter

W-- Thickness

 

 

0.1mm Diamond Dicing Blades Without Matrix High Precision Cutting 0

 

     

W (mm)

 

D (mm)

 

H (mm)

 

0.1-1.0

 

50-120

 

32, 40, 52, 70

 

 

 

Over 15 years of developing and producing experience in high precision super hard material tools, we have 

established a high efficiency system to provide stable performance wheel products.

 

We welcome yr free inquiry for any question in our diamond cutting wheels.  In order to supply exact wheel 

type and quotatioon to you,  if possible, better for you to provide us more information like followings:

 

1. Yr processing objects.

2. Yr OD, ID, Thickness data.

3. Grit size if possible.

4.  Rotary speed of your processing machine.

 

Many Thanks.

 

 

Contact Details
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