| Place of Origin: | CHINA |
|---|---|
| Brand Name: | TONGYU INDUSTY |
| Model Number: | RTR1A8-006 |
| Minimum Order Quantity: | 5pcs |
| Price: | Usd30-50 Per Piece Fob |
| Packaging Details: | Plastic Inner box + Carton box outer side |
| Delivery Time: | 7-20days |
| Payment Terms: | T/T, L/C, D/P, Western Union |
| Supply Ability: | 10,000pcs per Month |
| Shape: | Super Thin Diamond Dicing, Round | Grinding Material: | Superior Diamond Grits |
|---|---|---|---|
| Type: | Integral Blade | Out Diameter: | 40-120mm |
| Inner Diameter: | 20 Or 40mm | Thickness: | 0.1-1mm |
| Grit Size: | 120-1500 | Processing Object: | Semiconductor, Optical Glass, Ceramics, Magnetic Material Etc. Etc |
| Bonded Type: | Resin Bonded | ||
| High Light: | 58mm 0.2mm Diamond Saw Blades,Semiconductor 0.2mm Diamond Saw Blades,40mm 0.2mm Wafer Dicing Blade |
||
0.2MM Thick Ultrathin Resin Bonded Diamond Dicing Blade for High Precision Cutting
Super Hard Material Cutting Tools, also called Dicing Wheel or Saw Blade
Sample blade specification: 58*40*0.2mm ( D * H * T)
We use resin powder to increase the flexibility of cutting blades in order to supply high performace of flexible cutting
for many objects. such like to Semiconductor,Optical Glass, Ceramics, Magnetic Material etc.
Diamond wheel shape and indicates:
D -- Out Diameter
H -- Inner Diameter
W-- Thickness
| W (mm) |
D (mm)
|
H (mm) |
|
0.1-1.0 |
50-120 |
32, 40, 52, 70
|
Feature of our Diamond Blade:
1. Excellent self-sharpness and cutting ability which can help reduce chipping, fractures and achive smooth surface finish
2. High wear resistance.
3. Ultra high precision diamond blades suitable for any single piece cutting and multi slices combined cutting.
4. High rigdity, high strength, high performance for damage resistance.
5. Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc
6. Different products formula and crafts can meet different processing objects.
7. All products are adapting high class diamond powder to ensure the cutting performance and long service life.
8. High qualiy blade with resonable costs to you.
Glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN (copper epoxy molding ), splitter, sapphire
More image of our Dicing Blade
Description of special cutting chip for PCB, single crystal and silicon wafer:
High precision cutting wheel is formed by diamond or CBN abrasive layer. According to different uses, We choose metal, resin, ceramics and other different binders to achieve the best cutting effect.
In addition, it can also complete the processing of V-shape or R-shape and other blade shapes. It is suitable for all kinds of materials to be cut, and it is a widely used cutting wheel.
Main features: 1. High precision, can be used for precision slotting and cutting; 2. Ultra-thin thickness, can save a lot of valuable materials; 3. High rigidity, high strength, long service life; 4. Sharp cutting, high processing efficiency.
Main cutting materials: diamond cutting wheel is mainly used for slotting and cutting processing of various non-metallic materials, It includes: 1. Semiconductor and its packaging materials; 2. Ceramic materials; 3. Magnetic materials; 4. Other materials: crystal, glass, quartz, gem, cemented carbide, printed circuit board, etc. CBN cutting wheel is mainly used for grooving and cutting processing of various high hardness ferrous metal materials, including tool steel, die steel, bearing steel, heat-resistant steel, stainless steel,Cast iron and other hard ferrous metals.
Over 15 years of developing and producing experience in high precision super hard material tools, we have
established a high efficiency system to provide stable performance wheel products.
We welcome yr free inquiry for any question in our diamond cutting wheels. In order to supply exact wheel
type and quotation to you, if possible, better for you to provide us more information like followings:
1. Yr processing objects.
2. Yr OD, ID, Thickness data.
3. Grit size if possible.
4. Rotary speed of your processing machine.
Many Thanks.
